There are some disadvantages of the method,based on laser diode and receiver,to detect the wafer notch,such as low mission success rate,long detecting time,complex machine structure and so on.
针对采用激光二极管和接收器检测晶圆缺口时存在的一次检测成功率低、检测时间长和机械结构复杂等缺点,为了缩短单片晶圆检测时间,提高晶圆搬运机的效率,本文提出了一种基于线阵CCD的检测方法。
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