Application Encapsulation是什么意思

网络释义

用法例句

Piezoresistive strain gauge array for packaging stress test;

测试封装应力用压阻式应变计阵列

Substrate strengthen design and O rings suspension package realize well effect non-stress packaging.

衬底强化设计和O型圈悬浮封装的巧妙结合实现了无应力封装。

Research of thermal stress and analysis of thermal characteristic for plastic ball grid array package

PBGA封装热应力研究与热特性分析

Thermal Stress Analysis and Optimization of SCSP Chip Package

叠层CSP芯片封装热应力分析与优化

Thermal Stress Analysis of Stacking Chip Scale Package under Power Load;

功率载荷下叠层芯片尺寸封装热应力分析

A Study on Thermal Stress and Invalidation for Chip Scale Package;

芯片尺寸封装（CSP）的热应力及热失效分析研究

Analysis on Thermal Stress and Thermal Reliability of BGA Packaging

BGA封装的热应力分析及其热可靠性研究

Study on Stress-Strain and Thermal Failure of Ball Grid Array Package

球栅阵列封装的应力应变及热失效研究

Research on the thermal stress and warpage of WLCSP device

晶圆尺寸级封装器件的热应力及翘曲变形

Research on MEMS Packaging by Induction Heating and Its Applications;

基于感应加热的MEMS封装技术与应用研究

A New Packaging Structure of Stress-Insensitive FBG Temperature Sensor

新型应力不敏感FBG温度传感封装结构

Application of Glass Sealed Technology in Aviation Thermocouple Production

玻璃封装工艺在航空热电偶生产中的应用

hot-sealing film bagged packing machine

热封薄膜袋式包装机

Analysis and Comparison of Thermal Stress and Hygrothermal Stress of Lead-free Flip Chip Solder Joint

无铅倒装焊点的热应力与湿热应力分析

Research on Encapsulation Technique of FBG Strain Sensor Under High Strain Working Condition

高应力状态下FBG应变传感器的封装研究

Thermal Analysis of LED Packages based on Heat Pipe Heat Sink

基于热管散热的LED器件封装热分析

The Analysis and Simulation of Temperature Field and Stress Field in an Oil Slurry Heat Exchanger;

油浆蒸汽发生器热应力计算及密封性能研究

Sealing Analysis under Cooling and Heating Cycle for Reactor Pressure Vessel in Nuclear Power Station;

核电站反应堆压力容器冷热态密封分析

Application of Hot-tapping and Plugging Technology to Emergency Repair of Heating Pipeline

带压开孔封堵技术在热力管道抢修的应用

Study on Size Effect of Induction Heatng and Characteristics of Induction Heatng Interconnection Technology for BGA Packaging

电磁感应加热尺寸效应及其BGA封装互连新方法特征研究