Terrestrial deposit是什么意思

网络释义

用法例句

Synthesis of UV Photosensitive Prepolymer for Build-up Multilayer Board;

积层电路板用UV感光预聚物的合成

Beneficial effects of cold-moist stratification on seed germination be- haviors of Abies pindrow and Picea smithiana;

冷湿层积法对印度冷杉(Abies pindrow)和长叶云杉(Piceasmithiana)种子萌发的影响(英文)

Effect of Stratification and Hastening Germination on Seedling Emergence and Height of Corylus heterophylla Fisch;

平榛种子层积催芽的试验研究

Changes in Isoperoxidase Patterns of Dovetree Davidia involucrata Seeds During Stratification;

珙桐种子层积期间过氧化物酶同工酶的变化

Study on the Photocurable System of Epoxy Acrylate Resin and the Photoimageable Ink for Build-up Multilayer Printed Circuit Board;

环氧丙烯酸酯光固化体系及积层电路板用感光成像油墨的研究

interlayer contact

层间接触-印制电路板的

interlayer continuity

层间连接-印制电路板的

copper foil laminate

铜箔叠层板-印制电路板的

Experimental Investigation into Deposition Uniformity of Laminated Template Electrodeposition

叠层模板电沉积中沉积均匀性的实验研究

multilayer and high density fine-pitch printed circuit board

多层和高密度细线距的印刷电路板；多层和高密度细线距的线路板

integrator circuit

积分器电路，积分电路

Metal Parts Manufactured by Laminated Template Electrodeposition

采用叠层模板电沉积工艺制备金属零件

EMI Reduction for Power Bus Structures in PCBs Using Magnetic Material Coating

印刷电路板供电系磁性材料涂层的应用

Analysis of the Flaw of Electric Charges Accumulation between Alignment Layer and Liquid Cystal Layer of Liquid Crystal Cell

液晶面板取向层与液晶层界面的电荷累积效应分析

Kingboard Laminates Limited

建滔积层板有限公司

Nam Hing Industrial Laminate Limited

南兴积层板有限公司

Phenolic cellulose paper copper-clad laminated sheets for printed circuits

GB/T4723-1992印制电路用覆铜箔酚醛纸层压板

General rules for copper-clad laminated sheets for printed circuits

GB/T4721-1992印制电路用覆铜箔层压板通用规则

Epoxide cellulose paper copper-clad laminated sheets for printed circuits

GB/T4724-1992印制电路用覆铜箔环氧纸层压板

Test methods for copper-clad laminated sheets for printed circuits

GB/T4722-1992印制电路用覆铜箔层压板试验方法

Epoxide woven glass fabric copper-clad laminated sheets for printed circuits

GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板

Low Cost Printed Flexible Multilayer Substrates

多层柔性衬底电路板的低成本丝网印刷