64 times as that of the conventional technology, and the throwing power is increased 7.
６３８倍，均镀能力提高７。
And raising the concentration of cuprous cya- nide as the main salt is helpful to increasing the current efficiency and throwing power and reducing the electroplating cost as well.
5g/L可以将碳酸钠浓度控制在工艺范围内;降低镀槽电压和增加阳极面积有利于降低碳酸钠的浓度;较高的主盐浓度可以提高镀液的电流效率和均镀能力,有利于降低电镀成本。
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