Thermal conductivity prediction of underfill and its affects on the flip chip temperature field;
底充胶导热系数预测及对倒装焊温度场的影响
Affects of Low Thermal Expansion Coefficient under fill on Reliability of Flip Chip Solder Joint;
低膨胀系数底充胶对倒装焊焊点疲劳可靠性的影响
The Probabilistic Designing of the Parameters of Flip Chip Microelectronic Package;
倒装焊微电子封装结构参数的概率设计
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